Issue link: https://iconnect007.uberflip.com/i/978458
MAY 2018 I PCB007 MAGAZINE 75 FullyIntegrated Pre-layupandSolderMaskCell Final Cure Alt Oxide Screen & Cure LDI Expose Load Station SMDeveloper SM side A SM side B Tooling-1 Tooling-2 Electrostatic Cleaner Tooling-3 Lay-up Room Plating line X-Ray Drill Drill Stacking Plate Wash Automaticstacking/destacking drillarea Figure 11: Integrated multilayer layup and lamination prep and the final cure for solder mask. Figure 12: Drill/router area stacking and destacking.