Issue link: https://iconnect007.uberflip.com/i/978458
36 PCB007 MAGAZINE I MAY 2018 as possible and as close to the PCB manufac- turers as possible to minimize transportation costs and environmental impact. Future Topics and 5G Onward To meet the speed requirements of trans- mission in copper, today's copper foil stan- dardization by IPC seems rather old and there needs to be a way to describe the roughness in microns (preferable), rather than today's VLP, VLP2, and HVLP. You can make the list long and very complex to write a bill of ma - terial to purchase the signal integrity people want or desire. • Copper foil standardization – Suggest three levels of Ra < 2 µm, < 5 µm, < 10 µm • Today reference IPC-4562A, Table 3-1 (Table 5). • Higher MOT requires new material and UL applications RTI/MOT 130−150°C • Design constraints for CAF/thermal design/HW to HW We also follow with interest UL's introduc- tion of the RTI/MOT of FR-15.1 (150°C) to in- crease the materials' temperature resistance. To accommodate greater densification of pat- terns, reliability of holewall-to-holewall capa- bility (CAF testing) is needed, along with im- proved throwing power into through-holes on boards greater than 3 mm (118 mil) thick. The high-performing, low-loss multilayer materi- als must also meet the multiple lamination re- quirements, especially for any layer designs re- quiring more than seven lamination cycles. Products Many new products will result. Enabled by 5G, these include autonomous vehicles and virtual reality systems using goggles. In short, the IoT will touch everything we do. Even the Super Bowl and the Olympics of 2018 were in- volved in 5G experimentation. This makes it possible to imagine the future others have pre- dicted and to do the things tomorrow that we dream of today. PCB007 References 1. The Big Mac Index, The Economist. Stig Källman is Senior Engineer PCB with Ericsson in Kumla, Sweden. Foil Profile μm μin S (Standard) N/A N/A L (Low Profile) 10.2 400 V(Very Low Profile) 5.1 200 X(No Treatment or Roughness) N/A N/A Table 3-1 Maximum Foil Profile Table 5: Maximum foil profiles. (Source: IPC-4562A, Table 3-1)