Issue link: https://iconnect007.uberflip.com/i/989774
80 SMT007 MAGAZINE I JUNE 2018 14) and producing borderline results at 0.50, but still showed no considerable difference in TE or CV between the two mounting tensions. To drill down the absolute worst-case scenar- ios looking for advantages of higher tension, the T4 and T5 prints on circular, copper- defined pads were examined at Time 0, and T4 prints after the 90-minute pause. As expected, this combination of variables produced the most unacceptable results. What was somewhat unexpected was the degree of failure as even at an AR of 0.69 (Figure 15), where deposit inconsistency with a standard tension foil was deemed unacceptable. In Figure 16, T5 powder again helped bring deposit characteristics that were on the border- Figure 14: Comparison of effect of foil mounting tension on print quality with Type 5 solder paste and best-case scenario pad design. Figure 13: Comparison of effect of foil mounting tension on print quality with Type 4 solder paste and best-case scenario pad design.