Minimizes solder beading
High ECM performance under low
standoff components
High print transfer efficiency with
low variation
Excellent wetting
Very low bridging, slump, and
solder balling
Indium10.1HF
Halogen-Free, No-Clean,
Pb-Free
S O L D E R P A S T E
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Typical Voiding
>40% Void Area
Indium10.1HF
<10% Void Area
