SMT007 Magazine

Solder Fortification ® Preforms ©2018 Indium Corporation QFN Edge Connector Through-hole RF Shielding • Increase solder volume to strengthen solder joint • Improve shape and volume of fillet to ensure joints meet IPC specifications • Eliminate costly, time-consuming processes • Packaged in tape & reel to maximize pick rate Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/SMTUF Contact us for the Solder Fortification ® Design Guide Click our video for more:

• Cover
• Featured Content — Flex Circuit Assembly
• Additional Content
• Column — Tackling the Challenges in Flex Assembly
• Feature — Flex Circuit Assembly: Challenges and Strategies for Success
• MilAero Highlights
• Feature Interview — Conversation with…Miraco: Strategies for Successful Flex Circuit Assembly
• Short — Global Smartphone Market Fell 3% in Q1 on China Slowdown
• Column — Advanced Digitalization Makes Best Practice Part 1: Digital Remastering
• Short — Infrared Spectrometer on a Chip
• Feature Interview — Conversation with…Vexos: Doing it Right the First Time
• Supply Line Highlights
• Feature Interview — Conversation with…Thermaltronics: Addressing Temperature Challenges in Flex Circuit Rework
• Short — RTW NEPCON China: Koh Young Discusses Smarter Inspection
• Column — IPC Addresses Skills Gap
• Short — Imec Develops Screen-Printing Process for Highly Efficient n-PERT Solar Cells
• Feature — Reflow Perspectives to Flex Circuit Assemblies
• Short — Northwestern Researchers Predict Materials to Stabilize Record-high Capacity Lithium-ion Battery
• Electronics Industry News and Market Highlights
• Article — Novel Approach to Void Reduction Using Microflux Coated Solder Preforms
• Article — Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency
• Top 10 Recent Highlights from SMT007.com
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead