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12 PCB007 MAGAZINE I JUNE 2018 Feature by the I-Connect007 Editorial Team I-Connect007's Patty Goldman, Barry Mat- ties, Andy Shaughnessy, and Happy Holden were recently joined by MacDermid Enthone team members Jordan Kologe, technical mar- keting specialist; Ted Antonellis, applications manager for electronics specialties; and Don Cullen, marketing director for electronics solu- tions and MacDermid performance solutions. The discussion topic was the wet processing end of PCB manufacturing. Patty Goldman: We're here to talk about wet processing for PCB manufacturing. What do we need our readers to know about wet pro- cesses? Don Cullen: We just got back from some cus- tomer roadmap sessions in China, Thailand, Taiwan, Singapore, Korea, Hong Kong. A cou- ple of the themes that are going through my head include the transition of automotive cir- cuitry to finally adopting HDI and microvia de- signs. It is kind of surprising they hadn't real- ly done it yet, but that seems to be happening this year. Also, there's a big theme around cir- cuit boards becoming more like IC substrates and IC substrates trying to emulate the cost and productivity advantages of circuit boards. We're all trying to marry up the technology and fine line/fine pitch metrics between wa- fers, IC substrates, and bare PCBs. It all affects the trends in SAP and modified SAP technol- ogy. Barry Matties: From the applications engineer point of view, what challenges are they looking to solve that's currently in place? Ted Antonellis: We support a lot of different pro- cesses. I spend most of my time in bonding chemistry, the alternative oxides. People want smoother and smoother coppers for signal in - tegrity, so there are newer processes that de- pend more on chemical bonding than the ac- tual mechanical bonding to improve on that. Aside from that, in some of the other circuit for-

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