PCB007 Magazine

94 PCB007 MAGAZINE I JUNE 2018 IMS 2018 International Microwave Symposium E June 10–15, 2018 Philadelphia, Pennsylvania, USA Eurosatory 2018 Defense and Security International Exhibition E June 11–15, 2018 Paris, France IPC E-Textiles 2018 Workshop E September 13, 2018 Des Plaines, IL, USA electronica India productronica India E September 26–28, 2018 Bengaluru, India electronicAsia 2018 E October 13–16, 2018 Hong Kong SMTA International E October 16–17, 2018 Rosemont, Illinois, USA TPCA Show 2018 E October 24–26, 2018 Taipei, Taiwan electronica 2018 E November 13–16, 2018 Munich, Germany HKPCA/IPC International Printed Circuit & South China Fair E December 5–7, 2018 Shenzhen, China Events Calendar Additional Event Calendars

• Wet Processing Trends 2018
• Featured Content — Wet Processing Trends 2018
• Additional Content
• Column — Staying Current on Wet Processes
• Feature Interview — MacDermid Enthone Talks Wet Processing Trends in 2018
• Short — Infrared Spectrometer on a Chip
• Supplier Highlights
• Feature — Autocatalytic Gold: How it Fits as a Final Finish
• Electronics Industry News and Market Highlights
• Feature Column — Developments in Wet Processing: Beyond Spraying and Dipping
• Feature — Advanced Copper Plating Process for Any Layer Fill Applications with Thin Surface Copper
• Short — RTW CPCA Show: AWP Discusses Whelen Engineering Project Success
• MilAero Highlights
• Feature — Characteristics of New Electroless Au/Pd/Au Process for Fine-Line Applications
• Feature Column — PTH Failure Mechanisms and Using IST as a Tool, Part 1
• Column — Lean Challenges: Standard vs. Non-Standard Products
• Short — Flexible and Dynamic Transport Solution for Future 5G Communications Developed
• Top 10 Recent Highlights from PCB007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• Subscription & Contact Info