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22 PCB007 MAGAZINE I JUNE 2018 holders at one time. There is some of that hap- pening. We have some programs, for example, at big Tier One auto suppliers where we get all the stakeholders together and then we come up with a design. Holden: Don, refresh my memory. The new company that you represent was a combina- tion of what other chemical companies? Cullen: We have the MacDermid Enthone In- dustrial Solutions business, so that's the lega- cy MacDermid, legacy Enthone, and some leg- acy OMG that was Electrochemicals, and Fidel- ity. Then MacDermid Enthone Electronics So- lutions draws from the same legacy companies for circuit board chemistry as well as the En- thone success in wafer plating and wafer level packaging, redistribution layer and copper pil- lar, and under bump metallization. We have the Alpha Assembly Solutions which is tradi- tional solders as well as pastes, pre-forms and fluxes, plus some advanced alternative mate- rials and recycling programs. And their Alpha Advanced Materials business, which is ma- terials used to connect the wafer to the sub- strate, or the substrate to the circuit board, and that's going to be redistribution layer poly and spheres and encapsulants and all that. There are a couple of other businesses not re- ally in this space. Our Offshore Solutions pro- vides fluids that monitor valves on offshore pe- troleum production rigs, and our MacDermid Graphics Solutions business does consumables used in the printing industry for transferring images onto printed materials. So there are select industries like smart- phones where they do consume materials from pretty much every one of our business- es. It sounds strange, but it happens. There is much more coordination among our business- es now. Matties: Is there anything that we haven't talk- ed about that you guys feel we should cover in this conversation? Cullen: I think those are the primary transitions this year, and each one is going to lead to some growing pains like the HDI into automotive, so we must consider what Happy is talking about with reliability. The substrate-like HDI designs for circuit boards, new designs, so our group who does the wafer metallization, they're talk- ing about a new way of viewing constructions instead of trying to modularize all package de- signs into fan-out wafer level packaging. Matties: I see. Thank you very much and take care. We appreciate your time. PCB007 Fourier-transform infrared (FTIR) spectrometers, which are widely used research tools to identify and an- alyze chemicals, are too large to use in the field. Attempts have been made to develop miniaturized FTIR spectrom- eters for integration into drones to monitor greenhouse gases, for example, or for integration into smartphones. Scientists at the University of Campinas's Device Re - search Laboratory (LPD-UNICAMP) in Brazil, collaborat- ing with colleagues at the University of California San Diego in the United States, have overcome these con- straints by developing an FTIR spectrometer based on silicon photonics, the technology currently used to pro- duce chips for computers, smartphones and other elec- tronic devices. Infrared Spectrometer on a Chip

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