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6 PCB007 MAGAZINE I JUNE 2018 SHORTS: Infrared Spectrometer on a Chip RTW CPCA Show: AWP Discusses Whelen Engineering Project Success Flexible and Dynamic Transport Solution for Future 5G Communications Developed COLUMNS: Staying Current on Wet Processes by Patty Goldman Developments in Wet Processing: Beyond Spraying and Dipping by Marc Ladle PTH Failure Mechanisms and Using IST as a Tool, Part 1 by Michael Carano Lean Challenges: Standard vs. Non-Standard Products by Didrick Beck HIGHLIGHTS: PCB007 Suppliers EIN007 Industry News MilAero007 Top 10 from PCB007 DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead 8 36 72 78 24 34 56 84 88 94 95 22 54 82 JUNE 2018 • ADDITIONAL CONTENT 36 78

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