LEADERSHIP
IN ELECTRONICS
INNOVATION
227 Freight Street, Waterbury, CT 06702 USA
©2018 MacDermid
Systek THF
MacuSpec VF-TH 200
Streamlining two processes into a single, easy-
to-use system, the MacuSpec VF-TH 200 is the
newest in advanced metallization processing.
Achieve through hole metallization and via filling
in the same bath, on the same boards, at the
same time, in under 60 minutes with minimal
copper buildup on panel surfaces.
The future of thermal management in IC
packaging is here. Systek THF is a two-step
bridge and fill process that fills plated through
holes with high quality, sturdy, and pure
copper metal, allowing for never-before-seen
improvements in design miniaturization and heat
removal from the package.
For more information:
electronics.macdermidenthone.com
infoelectronics@macdermidenthone.com
BRIDGE FILL
