Design007 Magazine

Design007-Jan2019

Issue link: http://iconnect007.uberflip.com/i/1071356

Contents of this Issue

Navigation

Page 85 of 97

86 DESIGN007 MAGAZINE I JANUARY 2019 1 Beyond Design: 10 Fundamental Rules of High-speed PCB Design, Part 3 E Planes are essential in today's high-speed multilayer PCBs. Unfortunately, the number of power supplies required is increasing dramatically with IC complexity. Now, accounting for them all has become a real challenge. The high number of supplies generally leads to higher layer count substrates. 2 Mentor Discusses New DFT, DFM, and Design Verification Tools E At electronica 2018, John McMillan, digital marketing program manager-Electronic Board Systems, and Mark Laing, business develop- ment manager-Valor Division of Mentor, a Siemens business, discuss new tools for PCB design verification, as well as design for manufacturing (DFM) and design for testing (DFT). 3 Top 10 Most-read Design007 News of 2018 E Every year, we like to take a look back at the most popular PCB design news and articles. These are the top 10 most-read PCB design news items from the past year. Check them out. 4 Quiet Power: Measurement-to- simulation Correlation on Thin Laminate Test Boards E A year ago, I introduced causal and frequency- dependent simulation program with integrated circuit emphasis (SPICE) grid models for simulating power-ground plane impedance. The idea behind the solution was to calculate the actual R, L, G, and C parameters for each of the plane segments separately at every frequency point, run a single-point AC simulation, and then stitch the data together to get the frequency- dependent AC response. This month, I will demonstrate how that simple model correlates to measured data and simulation results from other tools. Editor Picks from PCBDesign007 Barry Olney

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-Jan2019