PCB007 Magazine

PCB007-June2019

Issue link: http://iconnect007.uberflip.com/i/1129312

Contents of this Issue

Navigation

Page 71 of 93

72 PCB007 MAGAZINE I JUNE 2019 Article by Joan Tourné NEXTGIN TECHNOLOGY Micro-machining is used every day in circuit board manufacturing with both drill and rout- ing bits. Micro-machining is a very broad term for techniques used to shape an object. I in- troduce this term because micro-machining, in combination with the fabrication and process- ing of objects in 2.5D and 3D is not commonly used in circuit board manufacturing. But ver- tical conductive structure (VeCS) technology will change that. Today, the industry has available to it the in- frastructure needed to shape circuits in a dif- ferent way and to create new functions and ap- plications, such as higher density connections between internal and external layers and tuned connections that minimize signal distortion. VeCS is a multi-depth slot element currently achieved with CNC machines (part of today's infrastructure) using drill and router bits to create the shapes (Figure 1). The objective is to create a new structure that makes the verti- cal connections using the board real estate dif- ferently so that we do not comprise isolation. CAF/electron migration are the primary con- straints in reducing the distance between verti- cal connections (via hole, microvia, etc.). By using micro-machining, we can create struc- tures that are less–or not at all–sensitive to these isolation defects. VeCS-1, as described in the first article of this series, is a slot go- ing through the circuit from top to bottom. In this article, I will focus on VeCS-2 technology (blind slots) as more micro-machining tech- niques are required for VeCS-2 than VeCS-1. Note that the examples in this article all fo- cus on slots with the same depth. In a later Vertical Conductive Structures, Part 2: VeCS and Micro-machining Figure 1: The basic VeCS element shown from the bottom side using two traces and a power connection at the far end of the slot. Terms for the wide structures are cross route and bottom route.

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-June2019