PCB007 Magazine

PCB007-June2019

Issue link: https://iconnect007.uberflip.com/i/1129312

Contents of this Issue

Navigation

Page 63 of 93

64 PCB007 MAGAZINE I JUNE 2019 Averatek on the Future of Additive and Semi-additive Processing E Averatek's President and COO Mike Vinson talks with Barry Matties about the benefits semi-additive and additive processing can bring to the shop floor as well as some of the cur- rent challenges and limitations that continue to leave many manufacturers hesitant to imple- ment the technology. Alun Morgan on the Future of PCB Materials E The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a de- tailed overview of the current state of the elec- tronics industry. DuPont on New Beginnings and Empowering the Industry E Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from Du- Pont Electronics and Imaging. Including in- vestments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabrica - tors and design teams, as well as some excit- ing business updates coming this spring and summer. Making Materials Succeed: Past, Present, and Future Trends E Tony Senese—manager, business development group, Panasonic EMBD—gives Nolan Johnson an overview of materials and components as well as changing business models and meth- ods to make materials succeed and how to stay profitable. Nano Dimension Reports 2019 First Quarter Financial Results E Nano Dimension reported revenues of $1.69 million for the first quarter of 2019, compared to $1.7 million in the fourth quarter of 2018, and $635,000 in the first quarter of 2018. The increase compared to the first quarter of 2018 was attributed to higher commercial sales of DragonFly Pro systems. Rogers Comments on Commerce Dept. Designation of Huawei E Rogers Corporation commented that it has evaluated the recently issued U.S. Department of Commerce export control restrictions relat- ing to Huawei Technologies Co. Ltd. and its affiliates and is implementing additional com- pliance processes for sales to Huawei's fabri- cators and converters, which are Rogers' di- rect customers. Orbotech Celebrates Success of Orbotech Diamond and Discusses Future Trends E Barry Matties caught up with Meny Gantz— VP of marketing for Orbotech's PCB division— to talk about the drivers behind the success of Orbotech Diamond systems, the future, and Industry 4.0. Flexium Revenues to Surge on PI Board Shipment Growth in 2H19 E Taiwan-based Flexium Interconnect expects its revenues and profits to improve quarter by quarter on more shipments of PI (polyimide) boards for antenna use, after hitting the bot- tom in the first quarter of 2019 on weak de- mand for smartphones.

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-June2019