92 PCB007 MAGAZINE I JUNE 2019
Coming Soon to PCB007 Magazine:
JULY: Failure & Reliability
The pressure to improve failure and reliability perfor-
mance is increasing. We look at the latest developments
in reliability improvement for PCB fabrication.
AUGUST: Wet Processes
Wet processes are the core of printed circuit fabrication.
What's new? Are there new offerings down the road to
make your wet process capabilities sharper? Faster?
Greener? Easier to operate? Find out in this issue.
Events Calendar
Additional Event Calendars
IPC SummerCom
E
June 15–20, 2019
Raleigh, North Carolina, USA
2019 FLEX Korea
E
June 19–20, 2019
Seoul, South Korea
NEPCON Thailand 2019
E
June 19–22, 2019
Bangkok, Thailand
eSMART Factory Conference
E
June 20–21, 2019
Dearborn, Michigan, USA
PCB Pavilion @ LCD EXPO Thailand
E
June 27–29, 2019
Bangkok, Thailand
NEPCON South China 2019
E
August 28–30, 2019
Shenzhen, China
C3Bio Conference on Biosensors,
Bioelectronics and Biodevices
E
September 9–10, 2019
Bath, United Kingdom
C3Bio Training Workshop on
Lab-on-Chip
E
September 11–12, 2019
Bath, United Kingdom
EIPC PCB Pavilion @ WNIE Exhibition
E
September 18–19, 2019
Warwickshire, UK
