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Design007-Feb2020

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8 DESIGN007 MAGAZINE I FEBRUARY 2020 FEBRUARY 2020 • CONTENTS FLEX007 ARTICLE: Multi-board Etching: Managing Rigid-Flex Designs and Conductivity by Hemant Shah FLEX007 COLUMNS: Flex Segment Starts Strong in 2020 by Andy Shaughnessy Power and Thermal Management: Dealing With the Heat by Joe Fjelstad HIGHLIGHTS: Flex007 FLEX007 SHORTS: Gift Will Allow MIT Researchers to Use Artificial Intelligence in a Biomedical Device Thinfilm to Energize Innovation in the Wearables and Sensor Markets With Ultrathin, Flexible, Safe Batteries More and more OEMs are also moving into complex multi-board rigid-flex circuits, often for reasons related to space-saving and reliability. This technology can save money and real estate, but it brings with it a variety of caveats. Focusing on Flex 84 80 90 88 82 93 FLEX 84 80 90

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