88 DESIGN007 MAGAZINE I FEBRUARY 2020
EPTE Newsletter: Electroless Plating
for Flexible Circuits E
Electroless plating is a popular method in man-
ufacturing printed circuits or flexible circuits.
The electroless plating concept is not new; it
is used to protect conductors against oxida-
tion. However, it is not the default process
for printed circuit manufacturing. Dominique
Numakura explains.
DuPont and SCHMID Announce
Partnership For New PCB Plating
Applications E
DuPont Electronics & Imaging and SCHMID
Group have announced that they have entered
into a nonexclusive joint development agree-
ment to explore new PCB plating applications
to bring advanced innovations to their global
customers. The new solutions which will in-
clude equipment and chemistry are expected
to be launched in late 2020.
SEMI-FlexTech Launches Six New
Projects to Accelerate Flexible Hybrid
Electronics Innovation E
SEMI-FlexTech has announced the launch of
six projects to accelerate sensor and sensor
system innovations for new applications in in-
dustries including healthcare, automotive, in-
dustrial and defense.
Call For Papers Printed Electronics Europe:
Flexible Structural Hybrid E
IDTechEx is now accepting applications to pres-
ent in May at Printed Electronics Europe 2020
in Berlin, Germany. Tell us about your new
concepts, technologies, materials and applica-
tions. Successful submissions will be speaking
alongside global experts flying in from all over
the world.
DuPont Introduces New Pyralux
and Riston Products E
DuPont Interconnect Solutions has announced
that it is introducing several new products
across its DuPont™ Pyralux® and Riston® prod-
uct families to address a diverse set of needs
for both the manufacture and performance of
advanced electronics devices.
DuPont Interconnect Solutions Expands
Insulectro's Role in North America E
DuPont Interconnect Solutions announced
recently that it is expanding Insulectro's role in
North America by adding Canada to its
sales territory for DuPont™ Pyralux® flexible
circuit materials.
Flexible Thinking: Additive
Manufacturing of PCBs E
We are seeing increasing interest in technol-
ogies that will allow one to make electron-
ic substrates in near real-time using additive
processing techniques and 3D printers. It is a
true game-changer in product development.
The surge in interest in additive manufactur-
ing technologies shown in recent times—as in-
dicated by the significant increase in published
articles and press releases—suggests that the
electronic interconnection manufacturing in-
dustry could be on the verge of a manufactur-
ing renaissance.
Toyochem Develops Highly Flexible EMI
Shielding Film For High-speed FPCs E
Toyochem Co., Ltd., a member of the Toyo Ink
Group, has launched a highly flexible electro-
magnetic interference (EMI) shielding film, the
LIOELM™ TSS510-HF, designed to meet the de-
manding performance requirements of 5G flex-
ible printed circuits (FPCs).
