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Enabling 5G From Start to Finish Circuitry • Semiconductor • Assembly macdermidalpha.com © 2020 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. Supplying innovative specialty processes and materials across the entire 5G electronics supply chain. CIRCUITRY SOLUTIONS High Speed Innerlayers Molded Interconnect Devices Primary Metallization Electrolytic Copper Metallization High Density Interconnects / mSAP IC Substrate / RDL Final Finishes SEMICONDUCTOR SOLUTIONS Ag Sintered Die Attach Materials RF Shielding Paste and Liquid Fluxes Fine Pitch Solder Pastes Solder Spheres Wafer Level Packaging Damascene Copper Moisture & Hydrogen Getters Wafer Lithography ASSEMBLY SOLUTIONS Solder Pastes Cored Wire Adhesives Underfill Encapsulant Preforms Bar Solder Liquid Soldering Flux Improving Reliability & Enabling Complex Board Designs Reducing Total Cost of Ownership Increasing Thermal and Electrical Conductivity Meeting Compliance and Sustainability Standards

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