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PCB007-Dec2021

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DECEMBER 2021 I PCB007 MAGAZINE 121 sion is a material-related issue where the resin has recessed or shrunk back away from the plating. is is evident generally aer thermal stress. According to the IPC 600 H, resin reces- sion is permissible. I am a true believer in the inter-relatedness of processes and the origin of process-related defects. It is helpful to keep a few things in mind when troubleshooting a process issue. To be successful at troubleshooting a problem, common sense usually applies. Basically, one must first: • Identify the problem or problems (be as specific as possible) • Determine possible causes (look for links to those other less obvious processes) • Methods and procedures to test to see which causes apply • Test the assumptions • Implement corrective action While this sounds like an oversimplification, this approach is required to properly identify and attack the problem at hand. A structured routine is really what is required. Remember the most critical success factor is being able to get to the root cause of the problem. Stop the finger pointing and get the different process teams to work together. PCB007 Michael Carano is VP of technol- ogy and business development for RBP Chemical Technology. To read past columns or contact Carano, click here. Figure 4: Example of resin recession.

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