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50 DESIGN007 MAGAZINE I APRIL 2022 Previously in this column, we've explored the digital transformation of different aspects of the traditional electronic systems design pro- cess. is time I'll look at emerging technolo- gies for additive manufacturing, but with the same goal: an optimized digital thread through design, verification, and manufacturing. Additive manufacturing has been around electronics since thick-film screened hybrids came on the scene more than 30 years ago. And while those never quite went away, they never gained the prominence we all expected along- side the more traditional laminated, subtrac- tive-etched PCBs. Today, emerging technolo- gies are bringing a resurgence in additive man- ufacturing, thanks to a host of new materi- als, machines, and processes. Electronics have historically b e e n d i s c r e te s t r u c tu r e s e n c a p s u la te d i n s o m e mechanical package. e drive now is to integrate electronics more seam- le s sly into the end- product's form factor, requiring circuits that are flexible and/or con- formal to the contours of any product surface. In addition to reduced size and weight, other drivers include customiza- tion with localized manufacturing, reduction in part count, new 3D structures, and a reimagined supply chain. ere are several applications for this new technology, including radar systems and other sensors molded to the surface of an airplane, smart textiles with integrated sensors to mea- sure human performance and provide identifi- cation, and medical bandages that sense infec- tion and accelerate healing. Cars are rife with sensors across both the exterior and interior surfaces, conforming to the design of the car, not the other way around. Even product pack- aging includes sensors that track conditions during shipment to ensure quality. Design for Additive Manufacturing From the designer's perspective, these technologies can be bro- ken into planar and non-pla- nar categories. Planar elec tronic s a r e d e s i g n e d w i t h processes like those used for traditional, flat PCB-like layered structures. e manu- facturing may be very different (e.g., using an additive pr inter), b u t i t 's s t i l l c r e a t i n g the structure one planar laye r a t a t i m e. Po s t - production, they can The Digital Transformation of Advanced Additive Electronics Digital Transformation Feature Column by David Wiens, SIEMENS EDA