Design007 Magazine

6 DESIGN007 MAGAZINE I APRIL 2022 SHORTS It's Only Common Sense: How to Develop Great Leaders Trouble in Your Tank: Additive, Semi- Additive and Subtractive Fabrication All Systems Go: Find and Fix Thermal PCB Problems Sooner Than Later Boeing, AWS Join Forces to Transform Aerospace Design and Manufacturing Happy's Tech Talk: Semi-Additive Processes and Heterogeneous Integration Helping the World Build Electronics Better DEPARTMENTS Career Opportunities Educational Resource Center Advertiser Index & Masthead HIGHLIGHTS PCB007 MilAero007 Top Ten Editor's Picks ARTICLES Book Review—The Printed Circuit Designer's Guide to... Stackups: The Design within the Design by Skyler Sopp DFM 101: Solder Mask and Legend by Anaya Vardya COLUMNS Additive Design: The Same, but Different by Andy Shaughnessy Leaning into Lean Manufacturing by Matt Stevenson Using Touchstone Files to Build Measurement Confidence by Martyn Gaudion The Importance of Circuit Features for Millimeter-Wave Applications by John Coonrod Design for Test, Part 3 by Vern Solberg Mandatory Masking Guidelines by Kelly Dack Turn Down the Heat, Go Green on Resins by Beth Turner 21 30 39 64 69 88 109 124 125 70 82 106 43 90 10 40 54 66 72 76 84 APRIL 2022 • ADDITIONAL CONTENTS 54

• Design007 Magazine — Additive Design
• Feature Contents — Additive Design: The Same, but Different
• Additional Contents
• Flex007 Contents
• Column — Additive Design: The Same, but Different
• Feature Interview — Additive Design: Same Steps, Different Order
• Short — It's Only Common Sense: How to Develop Great Leaders
• Feature Article — Designing Additive and Semi-Additive PCBs
• Feature Article — Additive Manufacturing Requires Additive Design Techniques
• Short — Trouble in Your Tank: Additive, Semi-Additive and Subtractive Fabrication
• Feature Article — Designing PCBs With Additive Traces
• Feature Column — Burning Questions About Designing for SAP
• Short — All Systems Go!: Find and Fix Thermal PCB Problems Sooner Than Later
• Column — Leaning into Lean Manufacturing
• Book Review — The Printed Circuit Designer's Guide to… Stackups: The Design within the Design
• Feature Column — Designing for the SAP Fabrication Process
• Feature Column — The Digital Transformation of Advanced Additive Electronics
• Column — Using Touchstone Files to Build Measurement Confidence
• Feature Interview — Calumet on Additive and Semi-Additive Design
• Short — Boeing, AWS Join Forces to Transform Aerospace Design and Manufacturing
• Column — The Importance of Circuit Features for Millimeter-Wave Applications
• Short — Happy's Tech Talk: Semi-Additive Processes and Heterogeneous Integration
• PCB007 Highlights
• Column — Design for Test, Part 3
• Column — Mandatory Masking Guidelines
• MilAero007 Highlights
• Column — Turn Down the Heat, Go Green on Resins
• Short — Helping the World Build Electronics Better
• Article — DFM 101: Solder Mask and Legend
• Flex007 Column — The Fascinating History of Wearable Electronics
• Flex007 Short — Fresh PCB Concepts: The Right Board for the Flex Job
• Flex007 Highlights
• Top Ten Editor's Picks
• Career Opportunities section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• Problems Solved! Subscribe to our magazines.