Design007 Magazine

Design007-June2022

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6 DESIGN007 MAGAZINE I JUNE 2022 SHORTS COLUMN EXCERPT—All Systems Go: Electronic Data Management— Can You Design Without It? BOOK EXCERPT: The Printed Circuit Designer's Guide to... Stackups— The Design within the Design SEMI Europe Honors Outstanding Leadership in Microelectronics DEPARTMENTS Career Opportunities Educational Resource Center Advertiser Index & Masthead COLUMNS Will DWM Unite the Product Development Family? by Andy Shaughnessy Copper Pours in High-speed Design by Barry Olney Bringing PCB Quoting into the 21st Century by Matt Stevenson Supply Chain Resilience, Part One: The Supply Chain Problem by Stephen V. Chavez An Overview of Copper Foils by John Coonrod Optimize Your Thermal Management by Jade Bridges The Many Benefits of Eliminating (Most) Solder by Joe Fjelstad HIGHLIGHTS PCB007 MilAero007 Flex007 Top Ten Editor's Picks 32 51 79 97 110 111 8 34 52 68 76 80 86 40 56 92 94 JUNE 2022 • ADDITIONAL CONTENTS 76 80

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