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JULY 2022 I PCB007 MAGAZINE 77 not only chips but also organic substrates, advanced multilayer boards, as well as assem- bly and test (OSAT). If we are serious about the future of the tech industry in North Amer- ica, it is time to recognize that without circuit boards and IC substrates, there is no semicon- ductor industry. For the United States to jump the technology curve and enhance the competitive positioning of the PCB fabrication base, we must embrace HDI and Ultra HDI as the standard design set for advanced electronics manufacturing. But it is not a simple technology to master. It will require significant investment in capital equip- ment, workforce training, and development and adoption of new processing technologies including semi-additive and alternatives to conventional metallization. Fabricators must master key technologies and processing if they wish to be a credible supplier of this growing technology, including: • Tooling and materials selection • Small hole drilling and micro-drilling • Laser via formation • De-smear, metallization, and hole plugging • Fine-line and tight-registra- tion, image transfer, and etching • Blind-via plating (super fill copper) • Quality control and qualifications (test vehicles, reliability verification) All that said, the scope of investments necessary to jump start the U.S. PCB indus- try is significantly lower than those needed for semicon- ductor facilities. Based on pri- mary research conducted by this author over the past sev- eral months, the key lies in increasing both manufactur- ing capacity and advanced technical capabili- ties for the top 100 PCB fabrication entities in the U.S. For each facility, the advanced capa- bilities necessary to increase yields and tech- nical capabilities can be purchased for $10 mil- lion to $12 million. is includes state-of-the- art laser drilling equipment, laser direct imag- ing, the latest technology for registration and subtractive processes, and complete upgrades for via filling, metallization, and in-house qual- ity control. e suggested investments and rel- ative costs are shown in Table 1. e estimates shown in Table 1 add up to approximately $10 million. Granted this is a snapshot of the capital expenditures required to increase one facility's capacity and advanced manufacturing capabilities; however, it rep- resents a critical starting point. It does not include investments in increasing the manu- facturing footprint through buildouts or lease- hold improvements. How would a small- to mid-sized PCB fab- ricator that already has reasonable capabilities Table 1: Investments needed to position PCB Fabs for future success.