PCB007 Magazine

PCB007-Sep2022

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6 PCB007 MAGAZINE I SEPTEMBER 2022 SHORTS At Water's Edge: Self-assembling 2D Materials at a Liquid-Liquid Interface When Light and Electrons Spin Together DEPARTMENTS Career Opportunities Educational Resources Advertiser Index & Masthead HIGHLIGHTS MilAero007 PCB007 Suppliers Top Ten from PCB007 COLUMNS Nano-Cu Paste for Microvias by Happy Holden Electrodeposition of Copper, Part 3: Plating Distribution and Throwing Power by Mike Carano Leadership 101: The Law of Timing by Steve Williams ARTICLES & INTERVIEWS Korf and Strubbe: Material Witnesses with Dana Korf and John Strubbe ICT Webinar: Your Journey to a Smart Factory by Happy Holden Microvias Can Be Stacked in Certain Packages with Gerry Partida White Paper Excerpt: Next Progression in Microvia Reliability Validation— Reflow Simulation of PCB Design Attributes and Material Structural Prop- erties During the PCB Design Process by Gerry Partida The New World Order of JIC by Dan Beaulieu Lessons Learned: Communication Still the Key with Kelly Dack 64 72 90 40 46 56 61 76 82 75 88 97 108 109 54 80 94 SEPTEMBER 2022 • ADDITIONAL CONTENT 72 56

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