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72 PCB007 MAGAZINE I SEPTEMBER 2022 ese are: • Overall composition of the electrolyte • Polarization influence • Conductivity of the electrolyte • Cathode efficiency/current density curves • Geometry of plating system/plating cell design • Other factors such as use of organic addition agents • Substrate composition and structure • Surface preparation and pre-treatment When studying electrodeposition, one needs to understand that current distribution has two components: • Primary current distribution • Secondary current distribution Introduction Success in the plating room rests largely on the understanding and the application of those critical principles that govern the pro- cess of electrodeposition (oen referred to as electroplating). is month, I look at the fun- damentals of plating distribution and throw- ing power, and what that means for the circuit board fabricator. Current Distribution ere are many factors that influence the flow of current in the electroplating cell and, ultimately, the distribution of the metal across the part, along with the concept of throwing power. Electrodeposition of Copper, Part 3 Plating Distribution and Throwing Power Trouble in Your Tank by Michael Carano, RBP CHEMICAL TECHNOLOGY

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