PCB007 Magazine

PCB-Dec2017

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30 The PCB Magazine • December 2017 Final Finishes: Taking Gold Thickness into Account Martin Bunce was one of several people from MacDermid Enthone who presented at SMTA In- ternational this year. He sat down with me for a chat about his paper on final finishes, particularly with regard to controlling gold thickness. Frontline PCB Solutions' InCAM Software Reaches a Record 1,500 Seats Frontline PCB Solutions announced at the TPCA show today that its InCAM preproduction CAM solution has achieved a record number of 1,500 seats worldwide. Orbotech Revolutionizes the AOI Room with 4-in-1 AOI Solution Orbotech's new Ultra Dimension Series reduces the total cost of ownership of the PCB AOI room by in- tegrating leading pattern inspection, laser via in- spection, Remote Multi-Image Verification (RMIV) and 2D metrology into a single AOI solution. Elmatica Expects Copper Foil Shortage to Last Longer Printed circuit broker Elmatica encourages open dialogue around the copper situation and its con- sequences. With several governments desiring a shift towards cleaner new-energy vehicles, and an all-electric automotive industry, the copper shortage will last longer than first anticipated. Trouble in Your Tank: The Critical Importance of Rinsing, Part 2 In Part 1 of this series on the importance of rins- ing, the author presented an overview of the crit- ical aspects of rinsing as it applies to the overall quality of a printed circuit board, with consider- able space devoted to water conservation. Thus, we now turn to how one can improve rinsing ef- fectiveness without increasing water consumption and, by default, significant waste treatment costs. IPC Awards IPC-4101 Qualified Product Listing to Ventec International Group Ventec International Group is delighted to an- nounce an IPC-4101 Qualified Products Listing (QPL). The IPC's validation services program has qualified VT-90H and VT-901 to specification sheet 41 of IPC-4101E, specification for base materials for rigid and multilayer printed boards. Protecno Becomes the First French PCB Manufacturer to Invest in Orbotech's Nuvogo Direct Imaging Solution Orbotech Ltd. today announced that Protecno, a France-based electronics manufacturer and part of Groupe GTID, has purchased the first Orbotech Nuvogo direct imaging (DI) solution to be in- stalled in France. MacDermid's Metallization Fills Microvias, Plates Through-Holes in One Step MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, has released the MacuSpec VF-TH 200 process, a high- performance DC electrolytic copper metallization process for simultaneous via filling and through- hole plating. Video from productronica 2017: Electra Polymers Updates on the Latest Developments in DI Soldermask From the show floor at productronica 2017, Elec- tra Polymers' Sales Manager Ashley Steers discuss- es the state of the art in soldermask for direct im- aging. Sales and Marketing Director Shaun Tibbals comments on developments in ink-jet soldermask and opportunities in wafer-level packaging. TUC Appoints John Strubbe Vice President of Technology The position is within the Development and Appli- cation Center (DAC) located in Jhubei City, Hsin- chu County, Taiwan. Strubbe has been working with TUC since June 2015. Supply Lines Highlights

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