30 The PCB Magazine • December 2017
Final Finishes: Taking Gold Thickness
into Account
Martin Bunce was one of several people from
MacDermid Enthone who presented at SMTA In-
ternational this year. He sat down with me for a
chat about his paper on final finishes, particularly
with regard to controlling gold thickness.
Frontline PCB Solutions' InCAM Software
Reaches a Record 1,500 Seats
Frontline PCB Solutions announced at the TPCA
show today that its InCAM preproduction CAM
solution has achieved a record number of 1,500
seats worldwide.
Orbotech Revolutionizes the AOI Room
with 4-in-1 AOI Solution
Orbotech's new Ultra Dimension Series reduces the
total cost of ownership of the PCB AOI room by in-
tegrating leading pattern inspection, laser via in-
spection, Remote Multi-Image Verification (RMIV)
and 2D metrology into a single AOI solution.
Elmatica Expects Copper Foil Shortage
to Last Longer
Printed circuit broker Elmatica encourages open
dialogue around the copper situation and its con-
sequences. With several governments desiring a
shift towards cleaner new-energy vehicles, and
an all-electric automotive industry, the copper
shortage will last longer than first anticipated.
Trouble in Your Tank: The Critical
Importance of Rinsing, Part 2
In Part 1 of this series on the importance of rins-
ing, the author presented an overview of the crit-
ical aspects of rinsing as it applies to the overall
quality of a printed circuit board, with consider-
able space devoted to water conservation.
Thus,
we now turn to how one can improve rinsing ef-
fectiveness without increasing water consumption
and, by default, significant waste treatment costs.
IPC Awards IPC-4101 Qualified Product
Listing to Ventec International Group
Ventec International Group is delighted to an-
nounce an IPC-4101 Qualified Products Listing
(QPL). The IPC's validation services program has
qualified VT-90H and VT-901 to specification sheet
41 of IPC-4101E, specification for base materials
for rigid and multilayer printed boards.
Protecno Becomes the First French PCB
Manufacturer to Invest in Orbotech's
Nuvogo Direct Imaging Solution
Orbotech Ltd. today announced that Protecno, a
France-based electronics manufacturer and part
of Groupe GTID, has purchased the first Orbotech
Nuvogo direct imaging (DI) solution to be in-
stalled in France.
MacDermid's Metallization Fills Microvias,
Plates Through-Holes in One Step
MacDermid Enthone Electronics Solutions, a
MacDermid Performance Solutions business, has
released the MacuSpec VF-TH 200 process, a high-
performance DC electrolytic copper metallization
process for simultaneous via filling and through-
hole plating.
Video from productronica 2017:
Electra Polymers Updates on the Latest
Developments in DI Soldermask
From the show floor at productronica 2017, Elec-
tra Polymers' Sales Manager Ashley Steers discuss-
es the state of the art in soldermask for direct im-
aging. Sales and Marketing Director Shaun Tibbals
comments on developments in ink-jet soldermask
and opportunities in wafer-level packaging.
TUC Appoints John Strubbe Vice President
of Technology
The position is within the Development and Appli-
cation Center (DAC) located in Jhubei City, Hsin-
chu County, Taiwan. Strubbe has been working
with TUC since June 2015.
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