Design007 Magazine

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• Desig007 Magazine: April 2019
• Featured Content — The Future of Design Data
• Additional Content
• Column — Get Smart!
• Feature — Smart Design Data Is Essential for Industry 4.0 Manufacturing
• Short — Tiny Silicon Nanoparticles Cement New Era for Ultra-high Capacity Batteries
• Feature Column — Standards-driven, Digital Design Flow for Industry 4.0
• Feature — Automation and the Smart Factory: Introduction to Industry 4.0
• Short — Photonics Breakthrough: Device That Shakes Light
• Feature — XNC Format: Gerber Takes Data Into the Future
• Feature Interview — XPLM: Using PLM to Integrate ECAD and MCAD Data
• PCB007 Highlights
• Column — San Diego Chapter Updates and More
• Column — Preparing for Tomorrow's Technology Today
• Column — Five Tips to Further Improve Resin Encapsulant Performance
• Short — Researchers Report Advances in Stretchable Rubbery Semiconductors, Integrated Electronics
• Column — Fast and Accurate Transmission Line Modeling
• Column — How Copper Properties Impact PCB RF and High-speed Digital Performance
• MilAero007 Highlights
• Article — EM Modeling: The Impact of Copper Ground Pour on Loss and Impedance
• Short — New Graphene-based Device Paves the Way for Ultrasensitive Biosensors
• Top 10 Editor Picks from PCBDesign007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead