PCB007 Magazine


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92 PCB007 MAGAZINE I JUNE 2019 Coming Soon to PCB007 Magazine: JULY: Failure & Reliability The pressure to improve failure and reliability perfor- mance is increasing. We look at the latest developments in reliability improvement for PCB fabrication. AUGUST: Wet Processes Wet processes are the core of printed circuit fabrication. What's new? Are there new offerings down the road to make your wet process capabilities sharper? Faster? Greener? Easier to operate? Find out in this issue. Events Calendar Additional Event Calendars IPC SummerCom E June 15–20, 2019 Raleigh, North Carolina, USA 2019 FLEX Korea E June 19–20, 2019 Seoul, South Korea NEPCON Thailand 2019 E June 19–22, 2019 Bangkok, Thailand eSMART Factory Conference E June 20–21, 2019 Dearborn, Michigan, USA PCB Pavilion @ LCD EXPO Thailand E June 27–29, 2019 Bangkok, Thailand NEPCON South China 2019 E August 28–30, 2019 Shenzhen, China C3Bio Conference on Biosensors, Bioelectronics and Biodevices E September 9–10, 2019 Bath, United Kingdom C3Bio Training Workshop on Lab-on-Chip E September 11–12, 2019 Bath, United Kingdom EIPC PCB Pavilion @ WNIE Exhibition E September 18–19, 2019 Warwickshire, UK

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