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78 PCB007 MAGAZINE I JUNE 2019 than cutting microsections or using a scan- ning electron microscope (SEM), but also non- destructive. The laser profiler can be applied to a panel without cutting any holes into it. While laser-profiling may not give you details, such as plating thickness, it is still a very ef- fective tool for checking slot widths, depth, roughness, etc. Micro-machining offers a lot of op- portunities. As stated at the begin- ning of this series, we limited our- selves to using only the equipment currently available in the industry to develop VeCS technology. When new equipment allows us to step beyond this limit, we will be able to create structures that look very different from what we know today—holes and slots that are curved or angled, for example. For now, though, we limit ourselves to the 2D type appli- cation in keeping with the processes available today. Acknowledgments NextGIn wants to thank WUS PCB China for performing the work in fabricating the sample and making the cross section results available. WUS has been a VeCS development partner over the last few years, dem- onstrating the capabilities of this new approach. NextGIn also wants to thank HPTec for supporting the de- velopment work in developing and supplying special router bits as well as supporting the WUS PCB team. I also want to thank HDP User Group International for allowing use of the cross section pictures in this article. HDP is running a test program that evaluates VeCS technology. About NextGIn Technology NextGIn Technology is a fabless company that develops and engineers solutions for the interconnect indus- try. It works with designers and fab- ricators in solving industry problems and will sell or license the technology to the industry. PCB007 Joan Tourné is CEO of NextGIn Technology BV. Figure 11: Measurements can be taken on the scanned profile in any direction, and the data is rendered in a 3D model (this image was taken after plating and before cross route). Figure 12: After cross route, we can check the flatness of the bottom surface. Any anomaly can be picked up, and debris from the process will be registered as well.