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JULY 2019 I DESIGN007 MAGAZINE 3 JULY 2019 • CONTENTS FEATURES: PCB Reliability: Via Design by Greg Ziraldo The Difference Between Quality and Reliability Interview with Denny Fritz IPC Reliability Forum Wrap-up Interview with Brook Sandy-Smith This month, we look into the secret life of vias as the culprit for failures and some of the reliability issues that technologists are facing today. Reliability & Vias 10 14 20 ARTICLE: The Impact of Inductance on Impedance of Decoupling Capacitors by Chang Fei Yee COLUMNS: Reliability Is a Team Sport by Andy Shaughnessy Stackup Planning, Part 5 by Barry Olney New and Thriving Chapters in Mexico by Stephen Chavez Five Best Practices to Ensure Manufacturability by Bob Tise Customer Support Is People Support by Tim Haag Conformal Coatings: How to Design Out Production Problems by Phil Kinner 54 8 26 34 38 44 48 10

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