Issue link: https://iconnect007.uberflip.com/i/1166358
90 PCB007 MAGAZINE I SEPTEMBER 2019 ness/height of the dielectric coating in a flex- ible hybrid electronics circuit with a die. Silver traces are shown on a clear, glossy substrate. A 2D gray-scale image from the scanned surface and additional 3D scans show 0.004" silver lines and printed pads for a 0402-size compo- nent are included as well. Figure 18: 3D view of the scanned area. Figure 19: Extracting a cross-sectional surface profile. Figure 20: Profile that can be used to determine trace height, width, and shape; gap width; radius of the substrate; and height of dielectric coating at the edges of the profile. Figure 21: Line confocal method sensors simultaneously capture 2D gray-scale image from the scanned area with a large depth of focus and without unwanted reflections. Figure 22: Microscope photo of 0.004" printed silver lines with 0.006" spacing.