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88 DESIGN007 MAGAZINE I FEBRUARY 2020 EPTE Newsletter: Electroless Plating for Flexible Circuits E Electroless plating is a popular method in man- ufacturing printed circuits or flexible circuits. The electroless plating concept is not new; it is used to protect conductors against oxida- tion. However, it is not the default process for printed circuit manufacturing. Dominique Numakura explains. DuPont and SCHMID Announce Partnership For New PCB Plating Applications E DuPont Electronics & Imaging and SCHMID Group have announced that they have entered into a nonexclusive joint development agree- ment to explore new PCB plating applications to bring advanced innovations to their global customers. The new solutions which will in- clude equipment and chemistry are expected to be launched in late 2020. SEMI-FlexTech Launches Six New Projects to Accelerate Flexible Hybrid Electronics Innovation E SEMI-FlexTech has announced the launch of six projects to accelerate sensor and sensor system innovations for new applications in in- dustries including healthcare, automotive, in- dustrial and defense. Call For Papers Printed Electronics Europe: Flexible Structural Hybrid E IDTechEx is now accepting applications to pres- ent in May at Printed Electronics Europe 2020 in Berlin, Germany. Tell us about your new concepts, technologies, materials and applica- tions. Successful submissions will be speaking alongside global experts flying in from all over the world. DuPont Introduces New Pyralux and Riston Products E DuPont Interconnect Solutions has announced that it is introducing several new products across its DuPont™ Pyralux® and Riston® prod- uct families to address a diverse set of needs for both the manufacture and performance of advanced electronics devices. DuPont Interconnect Solutions Expands Insulectro's Role in North America E DuPont Interconnect Solutions announced recently that it is expanding Insulectro's role in North America by adding Canada to its sales territory for DuPont™ Pyralux® flexible circuit materials. Flexible Thinking: Additive Manufacturing of PCBs E We are seeing increasing interest in technol- ogies that will allow one to make electron- ic substrates in near real-time using additive processing techniques and 3D printers. It is a true game-changer in product development. The surge in interest in additive manufactur- ing technologies shown in recent times—as in- dicated by the significant increase in published articles and press releases—suggests that the electronic interconnection manufacturing in- dustry could be on the verge of a manufactur- ing renaissance. Toyochem Develops Highly Flexible EMI Shielding Film For High-speed FPCs E Toyochem Co., Ltd., a member of the Toyo Ink Group, has launched a highly flexible electro- magnetic interference (EMI) shielding film, the LIOELM™ TSS510-HF, designed to meet the de- manding performance requirements of 5G flex- ible printed circuits (FPCs).

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