Issue link: https://iconnect007.uberflip.com/i/1212069
REAL TIME WITH... IPC APEX EXPO 2020 SHOW & TELL MAGAZINE I I-CONNECT007 77 Sood: My day job is to look for the implemen- tation of new technologies in our NASA mis- sions. We do not claim to have the most cut- ting-edge technology out there, but we do take a lot of risks in implanting new technology. When we talk about the latest technologies, very quickly, we get into the fastest, smallest, lightest processors and electronics. Looking at those three metrics, there are a lot of electron- ics involved when we're talking about newer processes. From a NASA perspective, I want to see how we can use some of the newer tech- nologies in our missions. How can we start do- ing fine-pitch area array packages like ball grid arrays? How can we start using higher layer count boards with microvias? From an IPC perspective, there's a lot of knowledge and experience out there. I see folks from my background—including from aerospace, defense, and telecommunications— so there are a lot of knowledge-sharing oppor- tunities. What I find to be the most exciting are the over-the-horizon technologies that are still in the R&D phase, such as the confluence of 3D printing with artificial intelligence. How are we going to implement that in a PCB? Further, how are PCB fabricators going to use a lot of the data that's available? How are end-users going to use a lot of the quality and reliability data? I see a number of opportuni- ties for developing guidelines or developing standards around those. I know IPC has the Industry 4.0 initiative going, which is a step in the right direction for factories of the future. But there are also more opportunities for AI and looking at these newer technologies, such as the 3D printing of electronics. From an assessment and test standpoint, another opportunity that excites me is looking at quality and reliability testing from a fresh perspective. Do we have to start making cou- pons and start doing full-blown DOE to get that reliability metric? How can we run these DOEs in a very efficient manner using some of the virtual qualification tools with AI? In other words, how can I run a test more efficiently without going through the whole nine yards of coupons and fabrication preconditioning and testing and data analysis and all that? From IPC committees, we've all seen the general trend in the industry where the aver- age or mean age of committee members is old- er. But when you go into the meetings, I see a lot of our young professionals coming up. I'm starting to mentor an emerging engineer from Calumet Electronics through the IPC Emerging Engineer Program because I believe in enhanc- ing the workforce and bringing in the younger generation and sharing the excitement of be- ing involved in this industry with them. Goldman: That's neat. I'm sure you'll enjoy that. Sood: I'm excited. I've mentored students and interns for the last 17 years. In fact, I was out taking my last intern to lunch the other day, and he asked me how many students I have mentored. I've been doing this for 17 years, and I've made it my priority everywhere I go to share what I've learned. I think I've probably mentored around 100 interns over the past 17 years consistently. I'm happy that IPC started the Emerging Engineer Program a few years ago; they're kind of following along the same path. I jumped in when Teresa asked me if I would sign up. I'm happy to do that.