Issue link: https://iconnect007.uberflip.com/i/1212069
78 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2020 SHOW & TELL MAGAZINE Goldman: The Fellowship Award comes with the Dieter Bergman Memorial Scholarship to be awarded to the university of your choice. What school did you choose? Sood: I chose the Aeroclub within the Aero- space Engineering Department of the Univer- sity of Petroleum and Energy Studies (UPES) in India. During a recent outreach event, I met with UPES students, including some from this club. I was very impressed with what I saw. The Aeroclub was initially created by a group of students with a passion for airplanes, but over the years, it has diversified itself into vari- ous other aerodynamic machinery like minia- ture hovercrafts and drones. The club organiz- es various events, the latest being a national drone competition, an event planned at the college. Goldman: That's great to hear. Again, congratu- lations, and thanks so much for your time. Sood: Thank you. S&T Dr. Bhanu Sood serves as the Goddard Space Flight Center Lead Engineer and NASA specialist managing the overall risk assessment, reliability, and assurance efforts pertaining to printed circuit boards and microelectron- ics packaging used in NASA Goddard's flight missions. Dr. Sood manages the development efforts for the JPSS Program, GOES, JWST, Landsat-9, WFIRST, LUCY, PACE/OCI, Restore-LEO, and a number of CubeSat missions. Before joining NASA, Dr. Sood was most recently the Laboratory Director at the CALCE Center at UMD, where his lab provided reliability and supply chain risk consultation to companies in the avionics, medical devices, telecom- munications, down-hole drilling, and automotive sectors. At UMD, Dr. Sood patented a technique for ultrasonic in- spection and health monitoring of lithium batteries. Be- fore UMD, he developed laser-based 3D printing and em- bedding processes at the U.S. Naval Research Laboratory. He patented a process for embedding circuits for surveil- lance applications. Dr. Sood has authored several hundred conference papers, presentations, and technical reports, five book chapters, and 32 peer-reviewed scholarly and techni- cal manuscripts. He is a member of the editorial board of SMT Journal and actively volunteers in a leadership role in technical program committees and standards develop- ment activities within SAE, IEEE, and IPC. He holds a doc- torate in electronics reliability, a master's degree in metal- lurgy and materials science, and a bachelor's degree in mechanical engineering.