Issue link: https://iconnect007.uberflip.com/i/1213413
20 PCB007 MAGAZINE I FEBRUARY 2020 of the International Organization for Stan- dardization (ISO). It has three main com- ponents: file transfer, access, and man- agement services; manufacturing message specification services; and X.500 services. The protocol includes SIP, MEGACO, MGCP, SS7, ISDN, GSM, MAP, CAS, LTE, UMTS, SS7 SIGTRAN, ISDN SIGTRAN, SIP I, GSM AoIP, Diameter, and others. This message automation tool covers solutions for both protocol simulation and protocol analysis. The application includes various test plans and test cases to support the testing of real- time entities. Along with automation capa- bility, the application gives users the un- limited ability to edit messages and control scenarios (message sequences). 'Message sequences' are generated through scripts." "MAPS is designed to work on TDM inter- faces as well as on the IP/Ethernet interfac- es. MAPS also supports 3G and 4G mobile protocol standards for testing the rapidly evolving mobile technologies. MAPS can simulate radio signaling protocols, such as LTE (S1, eGTP, X2) interfaces and UMTS (IuCS, IuPS, IuH), GPRG Gb, and GSM A over an IP transport layer." "MAPS test suite is enhanced to simulate multiple UEs and IMS core elements, such as P-CSCF, I-CSCF, S-CSCF, PCRF, MGCF in IMS core network. With the help of mobile phones and other simulated wireless net- works, the VoLTE Lab setup can be oper- ated in real-time for making VoLTE calls and for interworking with PSTN and VoIP networks. MAPS is enhanced to a high- density version and a special purpose 1U network appliance that is capable of high call intensity (hundreds of calls/sec) and the high volume of sustained calls (tens of thousands of simultaneous calls/1U platform)." Challenges of the Digitization of Design The ongoing challenge is the digitization of the CAD product model and all its specifica- tions so that it can drive setup and recipes in the new smart factory (Figure 8). ECAD tools and product specifications ensure a certain level of accuracy and repeatability; however, this information is still non-intelligent and non-digitized. The notes, specifications, and dimensions added to the single PCB or panel only convey a static and potentially incorrect representation of the manufacturing require- ments. Even in the best case, where all this additional information is created correctly, the non-intelligent information is still subject to potential misinterpretation or not even being understood. IPC-2581 is the evolving industry standard focused on achieving the goal of a complete DPM exchange (DPMX), but ODB++ also plans to evolve to fill this need. IPC-2581 The evolving IPC-2581 standard is one rea- son that IPC-CFX-2591 was developed so rap- idly. The DFM standard has been an IPC fo- cus for nearly 30 years. The CAD-to-CAM data transfer has been one of multiple files, spec- ifications, and notes (Figure 9). First, it was Gerber to EDIF, IPC-D-350, ODB, GenCam, Figure 8: Historic data description hierarchy breakdown. (Source: IPC)