Issue link: https://iconnect007.uberflip.com/i/1269815
JUNE 2020 I PCB007 MAGAZINE 51 Source, there were many requirements that were beyond our options portfolio when the project started, but in the end, we met all their needs. Every line is customized, and it's a simplification to say that in the high- volume Asia production facilities, they produce the same boards with the same process, and if they want another pro- cess, they buy another line. But to have the flexibility to run different plating ap- plications with one line was a special requirement from GreenSource, which we were happy to fully realize. Matties: You're introducing three or four new pieces of technology right now. That's rath- er ambitious. What was the motivation to bring out all of this technology in the same timeframe? Schatz: To bring several new products to the market can be quite ambitious, especially when you launch several at the same time. We look back at a long history in equipment develop- ment and have constantly refined our standard operating procedures, the communication with customers and OEMs, as well as our technol- ogy forecasting. We can also provide chemical process technology and the required manufac- turing equipment out of the same hand, which means we have a unique and strong competitive advantage. This understanding of the synergies between the equipment system and chemistry is what strengthens our total process solution and delivers a true value-add to our customers. There are several new equipment products on their way. At the moment, we are expand- ing our core horizontal system product line, as well as building up a new vertical copper sys- tems product line. For horizontal PCB trans- portation, we have recently launched two new systems—a new Uniplate concept and our Polygon platform. Our new Uniplate combines several new features and is the latest exten- sion of our well-established product line for desmearing and electroless copper metalliza- tion processes in high-end PCB manufacturing. The system is more maintenance-friendly and is equipped with more efficient pumps and new features for particle control. For exam- ple, by using tailor-made impellers in process pumps, in combination with flow-optimized piping, we have reduced the power demand by 50% but retained the same pump performance. This means that for a Uniplate P/LB, power consumption is reduced by 30kW, which offers a considerable cost saving across the year. We have redesigned the way samples are collected from process tanks, protecting the operator— most importantly—as well as the system com- ponents from any chemical splashes. To make the overall operation clearer and easier, the human-machine interface (HMI) is current- ly being improved, with a focus on allowing the user to easily navigate through the system through standardized icons, objects, and mes- sages. Another new feature is a revised electri- cal concept in which we have integrated every- thing into the line itself, making it easier and faster for installation on-site and reducing the overall machine footprint. Our new Polygon platform aims to meet the needs of those customers who are looking for a reliable, capable, and affordable systems so- lution. Designed in Germany and using many of the same features as our high-end Uniplate lines, Polygon machines are manufactured in Guangzhou, China, utilizing locally sourced parts that offer a high standard of quality. Cur- rently focused on the desmear and electroless copper processing, Polygon P/LB targets the mid-level PCB segments found in multilayer, Atotech team at GreenSource Fabrication plant, NH, USA.