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62 PCB007 MAGAZINE I JUNE 2020 nology to reduce the consump- tion of water and chemistry, it is the answer to environmen- tal friendly PCB production. The processes supported are desmear, electroless copper, and surface treatment (Figure 9). Product Lines: Vertical vPlate (New) New in 2020 is the vPlate se- ries of equipment. This vertical- continuous electrolytic plating line runs all of Atotech's con- formal and blind microvia filling plating and hole-filling process- es. Designed for the production of advanced thin substrates for HDI/SLP, rigid-flex, and IC pack- aging, it is capable of geome- tries of 15-micron traces/spaces down to 8/8-micron geometries using SAP and mSAP (modified semi-additive processes). This new equipment is designed for pattern-plating and panel-plating (Figure 10). MultiPlate (New) Another new vertical process- ing line is the MultiPlate series (Figure 11). These are intended for cleanroom applications, such as through-silicon vias (TSV), wa- fer/panel-level packaging (WLP), advanced packaging solutions, or embedded systems. MultiPlate W is capable of standard wafers and Taiko wafer with only 50 µm. MultiPlate P can handle large panels up to 650 x 610 mm. Spe- cial features like direct solution flow through the anode and free programmable agitation achieve a unique combination of high- speed plating with a distribution of <10%. The control is such that geometries of 2/2-microns are possible as well as complex Figure 8: New Horizon modules for high-end processes for the surface treatment of IC substrates. Figure 9: Polygon system, transportation specifications (Polygon is the new series of horizontal processing equipment built by Atotech China). Figure 10: vPlate for continuous vertical electrolytic plating is a new series of equipment released in 2020 and suitable for thin substrates and advanced HDI/SLP, rigid-flex, and IC substrate technologies.