www.elsyca-pcb.com
Download white paper
What
if
the
PCB
pre-production
engineer
could
upfront
identify
problem
areas
for
the
pattern
plating,
and
apply
auto-intelligent
copper
balancing
as
part
of
the
CAM
process
to
provide
a
right-first-time
panel
layout
for
production?
And
what
if
the
process
engineer
has
a
software
that
accurately
predicts
the
impact
of
plating
parameters
on
the
layer
thickness
distribution
to
increase
first
pass
yields
on
new
PCB
parts?
Learn
Learn
more
about
Production-proofing
PCB
copper
plating.
Plating
Simulation
Raises
Yield
and
Profitability
