Design007 Magazine

4 DESIGN007 MAGAZINE I SEPTEMBER 2020 FEATURES: Everything You Need to Know to Beat the Heat Interview with John Parry An Excerpt From the Book 'Thermal Management: A Fabricator's Perspective' by Anaya Vardya Thermal Laminates: One More Tool in Your Toolbox Interview with Jeff Brandman FEATURE COLUMNS: 5 Questions About Improving Thermal Management by Mark Thompson Thermal Management for PCB Designers: Staying Out of the Fire by Tim Haag FEATURES: Thermal Fundamentals With Mike Jouppi Interview with Mike Jouppi Thermal Management: Don't Believe the Datasheets by Dr. Johannes Adam Stop Relating Trace Temperature to Current Density by Douglas Brooks, Ph.D. Combatting Thermal Challenges With TRM Software Interview with Johannes Adam and Douglas Brooks IMS Materials for Improved Thermal Management Interview with Alun Morgan SEPTEMBER 2020 • FEATURE CONTENTS For much of the history of the printed circuit board, thermal management hasn't exactly been top of mind for designers and design engineers. But with the growth of electric and autonomous vehicles, along with telecom and mil-aero applications, thermal management and thermal design processes are becoming mainstream. So, in this issue, our expert contributors share their thoughts on the best methods to "beat the heat." Thermal Management 58 68 70 48 64 12 18 34 40 52

• Design007 Magazine – September 2020
• Feature Contents — Thermal Management
• Additional Contents
• FLEX007 Contents
• Column — Thermal Management Is a Multi-Pronged Effort
• Feature Interview — Thermal Fundamentals With Mike Jouppi
• Feature — Thermal Management: Don't Believe the Datasheets
• Column — Stackup Planning, Part 6: Impedance Variables
• Feature — Stop Relating Trace Temperature to Current Density
• Feature Interview — Combatting Thermal Challenges With TRM Software
• Feature Column — 5 Questions About Improving Thermal Management
• Feature Interview — IMS Materials for Improved Thermal Management
• Short — Allegro MicroSystems Acquires Voxel, Inc. to Drive Eye-Safe LiDAR Solutions
• Feature Interview — Everything You Need to Know to Beat the Heat
• PCB007 Highlights
• Feature Column — Thermal Management for PCB Designers: Staying Out of the Fire
• Short — HiPhi X Launches With Electronically Controlled NT Door System
• Feature — An Excerpt From the Book 'Thermal Management: A Fabricator's Perspective'
• Feature Interview — Thermal Laminates: One More Tool in Your Toolbox
• MilAero007 Highlights
• Interview — Monsoon Solutions: Creating the Perfect Fab Notes, Part 2
• Column — How to Know If a CAD Tool Is Right for You
• Column — IPC-2231 Captures Board Design Best Practices
• Short — Veoneer, Qualcomm to Power Next Generation ADAS and Autonomous Driving Systems
• Column — Education Unlocks the Golden Door to Freedom
• Short — Nordson Acquires vivaMOS, Adding Key Sensor Technology
• Column — Key Benefits of Resins and Differences From Coatings
• Short — Ethertronics Releases First UWB Antenna Solutions for Samsung Electronics
• FLEX007 Column — Let's Talk About the Basics of Flex
• FLEX007 Short — Foresight Completes Development of Automatic Calibration Software
• FLEX007 Column — Thermal Management: Electronic Technology's Rodney Dangerfield
• FLEX007 Article — Documenting Your Flex Circuit Design
• FLEX007 Highlights
• FLEX007 Column — Next-Generation Flex Circuits: Textile Base Flex
• FLEX007 Short — Kneron Boosts On-Device Edge AI Computing Performance With Cadence Tensilica IP
• Top 10 Editor Picks from PCBDesign007.com
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information