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OCTOBER 2020 I SMT007 MAGAZINE 37 erogeneous Integrated Packaging (SHIP) pro- gram was created by the Naval Surface War- fare Center (Crane, Indiana). The vision is shown in Figure 7, and some high-level met- rics are shown as well (Figure 8). The program is divided into SHIP-Digital and SHIP-RF, with Intel and Xilinx selected for Phase 1 on the dig- ital side, and Northrop Grumman, Qorvo, GE Figure 6: Timeline for the CHIPS manufacturing vision [4] . Figure 7: The SHIP program will create secure design, assembly, and test facilities for heterogeneous integration, as illustrated here [5] .