Issue link: https://iconnect007.uberflip.com/i/1293772
38 SMT007 MAGAZINE I OCTOBER 2020 Research, and Keysight Technolo- gies selected for RF. Each of those teams created a plan in Phase 1 to establish a self-sustaining HI manufacturing capability as a commercial entity, for either dig- ital or RF applications. The gov- ernment is willing to make a sig- nificant initial investment, but the primary goal is for that capability to be self-sustaining. We expect to include an update on the continu- ation of the SHIP program in the 2021 edition of HIR. New Government Investments It is notable that domestic semi- conductor manufacturing is get- ting significant visibility with the proposed "CHIPS for America Act." These incentives and invest- ments are substantial—on the order of $25B—and it is clear that the focus is on manufacturing. It is called out specifically in each top-line bullet (Figure 9). There is also $5B for Advanced Packaging, Category IOC FOC Scale Capacity: Volume (annual) 1k+ 10k+ 100k Silicon interposer Required Required Required Organic interposer Preferred Required Required Utilize SOTA COTS FPGA 1 and programmable devices Required Required Required Structured ASIC Preferred Preferred Required Security ITAR ITAR Classified Number of chips/package 2 4 8 12+ Supply chain target >50% US >75% US >90% US Can process singulated die Required Required Required Can process up to 300mm wafers Preferred Required Required Can process 200mm wafers Preferred Preferred Required Table 3: General Capacity and Capability for the SHIP-ATC. 1 Must include ability to integrate and test SOTA FPGA (<14nm), not required for RF-centric applications. 2 Could include, but not limited to, memory, ADC/DAC, transceivers, optical couplers, ASIC, structured ASICs, etc. Figure 8: High-level metrics for the SHIP program are useful for the HIR A&D Roadmap. There are more detailed metrics in the SHIP solicitation [5] . Figure 9: Proposed investment by the U.S. Government in semiconductor manufacturing [6 & 7] .