Issue link: https://iconnect007.uberflip.com/i/1307491
NOVEMBER 2020 I DESIGN007 MAGAZINE 33 or you can just make a slot halfway through, depending on where you want to interconnect the layers vertically inside the slot. Because it's a slot, it has very good fluid dis- tribution for plating. That's why it's the great- est thing in the last 20 years because it allows a conventional printed circuit shop to do equal or greater density than HDI without buying a laser drill or dealing with the aspects of blind via plating in metallization. Hofer: That's interesting because we're doing something very similar for one of the autono- mous vehicle companies, without even know- ing that this was out there. It has some chal- lenges, not the least of which is registration to the original slots, on into copper pullaway when you're drilling to remove the vertical plating as well. There are challenges that are faced that make it difficult. Holden: But it's not rocket science. The OEM takes out the license, not the fabricator, so the technology is free to the fabricator. Hofer: Shoot, I hope so. We're doing something like this without even knowing that somebody had made this a process. It's basically drilling and plating a slot, and then drilling away the copper in between it—somewhat not unlike doing castellation. Holden: My first impression was how is this dif- ferent from castellation? And the fact is that it's mostly around the BGAs so that you can get to all the connections on a BGA. Castella- tion is the outside edge. Shaughnessy: Was there anything else you'd like to mention? Hofer: Read I-Connect007's eBooks. They're free and offer good advice. I'd hate to sound like Channel 4, but "the more you know..." And we're gearing up for our NIST-800 certi- fication. We're doing 15 webinars a day. It's ridiculous. Shaughnessy: James, thanks for speaking with us. This has been great. Hofer: Thank you, Andy. Maybe we can meet at DesignCon 2021. DESIGN007 Senior Vice President, Simulation and Test Solutions, Siemens Digital Industries Software. "With Culgi technol- ogy as part of the Simcenter portfolio, process engineers will gain access to a comprehensive digital twin that combines micro-scale, meso-scale and macro-scale modeling." The acquisition of Culgi builds on Siemens' November 2019 acquisition of MultiMechanics, which added efficient prediction of solid material properties and behavior to the Simcenter portfo- lio. Through the addition of Culgi's soft materials simulation, Simcenter can now offer a unique integrated CAE solu- tion that enables performance-driven optimization of advanced materials. (Source: PR Newswire) Siemens has signed an agreement to acquire Culgi, a computational chemistry software company with a focus on multiscale simulations in the process industries. Culgi will join Siemens Digital Industries Software, where its solutions will expand simulation capabilities of the Xcel- erator portfolio with quantum and molecular chemistry models that seamlessly couple with the continuum approach in Simcenter STAR-CCM+ software. This unique engi- neering workflow can deliver signifi- cant cost savings and accelerate inno- vation in the materials and process industries, increasing the potential for product and process transformations. "Innovations in soft materials engi- neering begin at the quantum and molecular levels," said Jan Leuridan, Siemens Adds Multiscale Chemistry Modeling With Culgi Acquisition