Issue link: https://iconnect007.uberflip.com/i/1323994
50 SMT007 MAGAZINE I JANUARY 2021 • Pick and place • Reflow profile setup • X-ray for void inspection • AOI accuracy measurement • Cross-section test Goal: To test and document the full process for successful LED placement, including: • Solder paste printing and inspection • Low temperature cure adhesive dispensing • AOI for solder print characterization Figure 6: Graph of LED placements. Figure 8: X, Y accuracy data. Figure 7: Test results. Figure 9: X, Y accuracy data.