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Page 21 of 95

22 PCB007 MAGAZINE I MARCH 2021 leaves the fact that heat removal is essential for consumer acceptance. is is where Aurora Circuits can be help- ful to EV component manufacturers. We have experience with PCBs that have as much as 400–800 microns (25–45 oz.) of copper on one- or two-sided insulated metal substrates. Sub- strate metals can be either aluminum or cop- per with thermally conductive dielectrics to move the heat to cooling. Imagine 400 microns on two sides of a 2–4 mm copper or aluminum going to a cooling station for disposal of heat. We are also in production with a high-volume copper pedestal technology for direct heat re- moval from devices at a rate of 380 w/m 2 -°K (watts per square meter per degree Kelvin) and no dielectric in the thermal path. e advantages of a PCB are the ease of it- erative prototypes and ultimate assembly of the FETs and MOSFETs with electrical con- nections and heat removal. Make use of the in- house engineering team of your fabricator to solve these problems. PCB007 KJ McCann is director of marketing and customer relations at Aurora Circuits. Brian Zirlin is director of sales at Aurora Circuits. Denkai is the only electrodeposited copper foil manufacturer in North America. During this conversation, Chris provides his view of present trends, the need for higher speed digital designs, as well as the overall business conditions in the past year and emerging trends. Industry Trends—Present and Future Dan Feinberg Interviews Chris Stevens From Denkai America

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