Issue link: https://iconnect007.uberflip.com/i/1350598
10 PCB007 MAGAZINE I MARCH 2021 Feature Interview by the I-Connect007 Editorial Team Nolan Johnson, Barry Matties, and Happy Holden speak with Christian Klein, section manager for PCBs in the automotive electron- ics division, about Bosch's recent presentation on PCB requirements of the future in regard to automotive and electro mobility trends and challenges. Nolan Johnson: We've been looking through the presen- tation from Bosch on re- quirements for PCBs going on in the fu- ture, and there are quite a lot of r e q u i r e m e n t s . How do you see the requirements for printed circuit board manufactur- ing for automotive playing out? What do you see as the future landscape? Christian Klein: at depends on the area or on the use case. We have two big megatrends. One is electro mobility and the other one is connected cars. ese megatrends require dif- ferent technologies. For example, electro mo- bility needs substrates on which we can in- tegrate power components at temperatures up to 160°C, perhaps even higher, as well as currents up to several hundred amps. ose are difficult requirements for these kinds of PCBs. On the other side, we have PCBs for computers. ey are more like graphic cards or servers and are already used in the consum- er industry, but not in the automotive environ- ment. erefore, we have to distinguish be- tween these two use cases and with different requirements for the PCB. What is common is that they all need to survive the automotive environment. Barry Matties: Since t h e p r e s e n ta t i o n at the World Con- f e r e n c e w a s l o o k i ng a t f u - t u r e r e q u i r e - ment s, are the r e q u i r e m e n t s currently being met? K l e i n : A t t h e moment the require- ments are being met. But today, electrical cars oen still use power elec- tronics based on ceramic substrates. For auton- omous driving the requirements will increase. e new components need even more sophis- ticated HDI technology than before. Comput- ers need a higher data rate; it is increasing ev- ery year. erefore, we will be forced to use other materials in the future for the high-speed PCB Requirements for E-Mobility