Issue link: https://iconnect007.uberflip.com/i/1350598
4 PCB007 MAGAZINE I MARCH 2021 FEATURE ARTICLES PCB Requirements for E-Mobility Interview with Christian Klein The Future Is Electric by KJ McCann and Brian Zirlin TTM on the Future of Transportation Design Interview with Walter Olbrich EV Industry Facing Bottleneck Challenges Interview with Eduardo Benmayor FEATURE ARTICLES Simplified Assembly of Aluminum Flexible Circuits Interview with Divyakant Kadiwala Process Survivability, Reliability and Robustness Testing for EVs by Bob Neves Developing New SIR Standards by Graham Naisbitt TLPS Paste-Filled Vias for HF PCBs by Catherine Shearer MARCH 2021 • FEATURED CONTENT In this issue, we begin to map out the new landscape of transportation electronics. Trans- portation applications will be an active area of innovation in the coming years, as devel- opment continues in miniaturization, power management, environmental robustness and infrastructure. Strap in while we explore PCBs in transportation. The Future of PCBs in Transportation 10 18 24 30 38 48 62 70 24 18 30