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• Design007 Magazine — April 2021
• Feature Contents — The Simulation Issue
• Additional Contents
• Flex007 Contents
• Column — A Simulating Conversation
• Feature Interview — Barry Olney's High-Speed Simulation Primer
• Feature Interview — Bridging the Simulation Tool Divide
• Column — Growth and Trends in the Thermal Management Market
• Feature Article — Alternatives to Simulation
• Interview — Jan Pedersen: Getting Into Ultra-HDI with IPC Committees
• Short — World's Most Powerful Modular Robot
• Column — Friends and Enemies in Power Distribution
• Short — SolAero Technologies Powers OneWeb's Satellite Constellation
• Feature Article — Why We Simulate
• PCB007 Highlights
• Feature Column — Using Simulation to Assist With PCB Design
• Column — Embedding Resistor Elements, Part 1
• Short — Linde, Bluefors to Develop Cryogenic Cooling Solutions for Large-scale Quantum Computing Technology
• MilAero007 Highlights
• Column — The Power Behind the (PCB) Throne—Power Supply Design Tips
• Short — SEMI Applauds Initiatives to Bolster Semiconductor Manufacturing, Research in American Jobs Plan
• Interview — PCEA Expands in its Sophomore Year
• Feature Column — Simulating Stackup and Signal Integrity
• Column — Back-to-Back Chapter Meetings and More
• Short — Sushi-like Rolled 2D Heterostructures May Lead to New Miniaturized Electronics
• Column — Additive Electronics—Next Generation PCB Capabilities
• Flex007 Column — Termination of Flex Circuits
• Flex007 Short — Putting a Spin on Heusler Alloys
• Flex007 Highlights
• Flex007 Article — Book Excerpt: The Printed Circuit Designer's Guide to…Flex and Rigid-Flex Fundamentals—Chapter 2: Designing Flex Circuits for First-Pass Success
• Top 10 Editor Picks from PCBDesign007.com
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information