Issue link: https://iconnect007.uberflip.com/i/1359517
88 DESIGN007 MAGAZINE I APRIL 2021 sources which can contribute to the under- lying causes for failure. Process malefac- tors include a disregard for bare board and component cleanliness, incomplete heat- activation of no-clean fluxes, poor cleaning system performance, flux and/or cleaning agent entrapment under low standoff com- ponent packages, and outside contamina- tion. ere were many follow-up questions, which validated the interest in his topic. e meeting concluded with a raffle for $200 in prizes from our generous PCEA sponsors. e Silicon Valley Chapter hosted an online meeting February 25, fea- turing Joe Bevan, product manager of lamination for Insulectro, who spoke on PCB materials and their applications. Chapter chairman Bob McCreight welcomed the attendees to the "crowded" Zoom presentation meeting hall, gave a brief history of the long-standing Silicon Valley Chapter, and then introduced the speaker. Joe was supported by PCEA's own Mike Creeden, director of education for Insulectro, to queue up and relay the many questions which streamed in during the presentation. Joe covered many valuable topics including an overview of copper foil categories, production methods, the mSAP process, and a discussion on the rewriting of IPC-4562 Metal Foil for Printed Board Applications. During the business portions of these back- to-back meetings, Chairman Stephen Chavez showcased two new PCEA chapters, both of which had leaders attending the meetings: Luis Saracho, chairman of the Monterrey, Mexico Chapter, and Zachariah Peterson, who recently started the Portland, Oregon Chapter. Figure 2: Joe Bevan, Insulectro product manager of lamination. Figure 3: Mike Creeden, director of education at Insulectro.