Issue link: https://iconnect007.uberflip.com/i/1437606
72 PCB007 MAGAZINE I DECEMBER 2021 different sessions on printed circuit structures and additive manufacturing electronics. I want to stress that these are new ways of produc- ing PCBs. is is not just standard lamination and lithography techniques; these are brand new additive processes, not subtractive, and they are driving the new standards initiatives. We have brand new content coming out of the conferences that then goes straight into the standards committees. Matties: Are you adding zero waste into your technical programs? Kelly: Yes. If you look carefully at our Factory of the Future mission, it includes sustainable electronics. In the conference, we have a track dedicated to conscientious engineering, led by IPC's Kelly Scanlon. Matties: Obviously, we're seeing an accelerated curve in terms of AI and automation, but what do you see the factory really looking like in five or 10 years? Kelly: In the next five years, I expect a tremen- dous amount of improvement and focus on PCB fabrication techniques. We're seeing this in advanced packaging for IC substrates cur- rently, as well as second-level board assembly and fabrication. ere's a lot of emphasis on how PCBs are made. e driving force for that emphasis is miniaturization, speed, thermal, and multi-function. Partnering with fab tech- nique improvements is the construct of Fac- tory of the Future. Matties: If I'm a board fabricator and I'm look- ing at a five-year window for my business, what should my plan be focused on? Kelly: New materials, much tighter and tougher design points, plus expanding the technol- ogy offering and capability you have. If you're not looking at these new design points—HDI structures, SMT processes, printed circuits, and additive manufacturing—then, unfortu- nately, you'll be le behind. Matties: I thought we would have seen addi- tive in a stronger format a decade ago, but here we are today, and it seems to be accelerating nicely. Is that surprising to you at all? Kelly: No, it's not surprising. Unfortunately, the printed circuit board fabrication industry, as well as EMS providers, have continued to be commoditized. When something is commod- itized, it's deemed easy, as if anybody could do it. Yet we certainly know that's not true with printed circuit boards. I hope IPC can help the industry focus and promote these new tech- nologies, whether that's in board fab, Factory of the Future, or advanced packaging. ere is currently significant research and development on materials, processes, and advancements that must be overcome to make this advancement. Shaking off that commodity label is critical. Matties: You mentioned some new standards that will evolve out of the changing landscape; what standards should we be aware of ? And if you want to participate, obviously, there's an advantage to being on the early standards at the participation level. Kelly: Yes. You're already seeing our new Fac- tory of the Future digital standards portfolio grow. On the top of that list is the Connected Factory Exchange (CFX, IPC-2591). en we have cybersecurity, a model-based design stan- dard, and a digital twin standard that's forth- coming. at Factory of the Future portfolio We have brand new content coming out of the conferences that then goes straight into the standards committees.