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82 DESIGN007 MAGAZINE I APRIL 2022 Doug Pauls, Collins Aerospace, Receives Dieter Bergman IPC Fellowship Award E Doug Pauls holds a B.A. in chemistry and a B.S. in electrical engineering, worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004. SMT Perspectives and Prospects: Critical Materials, A Compelling Case, Part 1 E It has come time for a national strategy, in a deliberative and comprehensive manner, to address the critical materials/minerals. Doing so is increasingly critical to the long-term economy, national security, and the nation's global competitiveness. With the handling of conflict minerals as an exemplar, there is per- haps an even more urgent need to rally another concerted effort to tackle the critical materi- als/minerals. Cadence, Dassault Systèmes Partner to Transform Electronic Systems Development E Cadence Design Systems, Inc., and Dassault Systèmes announced a strategic partnership to provide enterprise customers in multiple vertical markets, including high tech, trans- portation and mobility, industrial equipment, aerospace and defense, and healthcare, with integrated, next-generation solutions for the development of high-performance electronic systems. David Pogue: Is the Fear of Change Holding Us Back? E David Pogue, an American technology and science writer and TV presenter, talks about today's technolog y, the breakthroughs that have shaped our current landscape, and whether fear of change and innovation is what's keeping us from the next technological revolution. IPC Applauds Biden's Focus on Semiconductors, Urges Passage of Competitiveness Legislation E During his State of the Union address, U.S. President Joe Biden urged Congress to pass much-needed funding for semiconductor man- ufacturing and other advanced technologies as part of a new competitiveness measure. EMC Launches 112Gb/s Design and New IC Substrate Materials at DesignCon 2022 E At DesignCon 2022, EMC will highlight extreme low loss materials EM-892K / EM- 892K2 ("K" indicates low Dk/Df glass, while "K2" stands for next generation low Dk/Df glass). Electronics Industry Praises Congress for Providing $7.5 Million for Lead-Free Electronics R&D E e U.S. Senate approved an FY 2022 spend- ing package that contains $7.5 million for fur- ther research and development on lead-free electronics in defense and high-performance applications, sending the measure to President Biden for his expected signature.

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