82 DESIGN007 MAGAZINE I APRIL 2022
Doug Pauls, Collins Aerospace, Receives
Dieter Bergman IPC Fellowship Award E
Doug Pauls holds a B.A. in chemistry and a B.S.
in electrical engineering, worked nine years
for the Navy, eight years as technical director
of Contamination Studies Labs, and 19 years at
Rockwell Collins (now Collins Aerospace), in
the Advanced Operations Engineering group,
where he is a principal materials and process
engineer. Doug was awarded the Rockwell
Collins Arthur A. Collins Engineer of the Year
Award in 2004.
SMT Perspectives and Prospects: Critical
Materials, A Compelling Case, Part 1 E
It has come time for a national strategy, in a
deliberative and comprehensive manner, to
address the critical materials/minerals. Doing
so is increasingly critical to the long-term
economy, national security, and the nation's
global competitiveness. With the handling of
conflict minerals as an exemplar, there is per-
haps an even more urgent need to rally another
concerted effort to tackle the critical materi-
als/minerals.
Cadence, Dassault Systèmes Partner
to Transform Electronic Systems
Development E
Cadence Design Systems, Inc., and Dassault
Systèmes announced a strategic partnership
to provide enterprise customers in multiple
vertical markets, including high tech, trans-
portation and mobility, industrial equipment,
aerospace and defense, and healthcare, with
integrated, next-generation solutions for the
development of high-performance electronic
systems.
David Pogue: Is the Fear of Change
Holding Us Back? E
David Pogue, an American technology and
science writer and TV presenter, talks about
today's technolog y, the breakthroughs that
have shaped our current landscape, and
whether fear of change and innovation is
what's keeping us from the next technological
revolution.
IPC Applauds Biden's Focus on
Semiconductors, Urges Passage
of Competitiveness Legislation E
During his State of the Union address, U.S.
President Joe Biden urged Congress to pass
much-needed funding for semiconductor man-
ufacturing and other advanced technologies as
part of a new competitiveness measure.
EMC Launches 112Gb/s Design and
New IC Substrate Materials at
DesignCon 2022 E
At DesignCon 2022, EMC will highlight
extreme low loss materials EM-892K / EM-
892K2 ("K" indicates low Dk/Df glass, while
"K2" stands for next generation low Dk/Df
glass).
Electronics Industry Praises Congress
for Providing $7.5 Million for Lead-Free
Electronics R&D E
e U.S. Senate approved an FY 2022 spend-
ing package that contains $7.5 million for fur-
ther research and development on lead-free
electronics in defense and high-performance
applications, sending the measure to President
Biden for his expected signature.
